Device Name: Power Device Vacuum Sintering Furnace

Manufacturer: German Centrotherm

Function Introduction:

This device can be used for vacuum welding between chips and substrates, as well as between substrates and baseplates.

Performance Introduction:

Maximum operating temperature of the equipment: 450℃  Minimum vacuum of the equipment: 0.1mbar

Device Name: Aluminum Wire Bonder

Manufacturer: German F&K

Function Introduction:

This device is used to achieve wire bonding connections in the internal circuit of IGBT modules, capable of wedge ultrasonic bonding of silicon-aluminum wires ranging from 100 microns to 500 microns.

Performance Introduction:

Capable of wedge ultrasonic bonding of silicon-aluminum wires ranging from 100 microns to 500 microns, ultrasonic output power ≥ 50W, continuously adjustable ultrasonic power.